Turnkey Camera Module Customization Services | OEM & ODM Engineering
▐ Products Description
End-to-End Camera Module Customization Services for Worldwide OEMs
A camera module that works on the bench does not automatically fit the finished product. Board dimensions, lens position, field of view, connector orientation, cable routing, power consumption and the target processor all affect the design. Our camera module customization work starts with these practical constraints, then identifies a sensor, optical configuration and interface that can be evaluated against the application requirements.
Customization can cover sensor selection, lens and FOV matching, PCB dimensions, FPC routing, connectors, filters and mechanical interfaces. USB 2.0 and MIPI CSI-2 are among the interface options considered for different project architectures; the available configuration depends on the selected hardware. Image processing, compression, network protocols and other system-level functions must be checked against the target processor and firmware rather than assumed to be features of the camera module itself.
For a new OEM camera project, the usual development path runs from requirements review to engineering validation (EVT), design validation (DVT), production validation (PVT) and mass production. The exact scope and timing depend on whether the project uses an existing module, requires a revised PCB or lens assembly, or needs new hardware development. Before quoting, it helps to establish the target application, resolution, interface, mechanical envelope, sample quantity and expected production volume.
▐ Core Features
Sensor & Lens Selection
PCB, FPC & Connector Adaptation
USB & MIPI Interface Options
Prototype Validation & Production Planning
▐ Technical Specification
| Item | Specification |
|---|---|
| Model | TS2M3V |
| Module Dimensions | 80 mm × 16 mm |
| Image Resolution | 2 MP / 1920 × 1080 |
| Supported Output Resolutions | 640 × 480, 800 × 600, 1280 × 720, 1920 × 1080 |
| Interface | USB 2.0 |
| Power Supply | USB Bus Power |
| Working Current | 400 mA |
| Compression Formats | YUV / MJPG |
| Sensor Format | 1/2.7 inch |
| Pixel Size | 3.0 µm × 3.0 µm |
| Dynamic Range | 85 dB |
| Lens Aperture | F/2.0 |
| Field of View | 76° |
| Optical Filter | RGB 650 ± 10 nm / IR 850 ± 10 nm (configuration to be confirmed) |
| Exposure Control | Automatic / Manual; detailed control range to be confirmed |
| Operating Temperature | -20°C to 60°C |
| Temperature for Stable Imaging | 0°C to 50°C |
| Image Clarity | Center: 300 lines; Corners: 250 lines (test method to be confirmed) |
| Object Distance | 60 cm |
| PCB Solder Mask | Black |
| Operating System | Windows XP, Windows 7, Windows Vista; Professional SP2/SP3 (exact OS compatibility to be confirmed) |
| Packaging | Anti-static Tray |
| Customization | Sensor, Lens, PCB, FPC, Connector and Mechanical Adaptation; feasibility depends on project requirements |
▐ Sensor Introduction
Sensor selection should start with the required image output and the conditions in which the camera will operate. Resolution alone does not determine image quality. Pixel size, exposure behavior, dynamic range, lens performance and the image-processing pipeline all influence the final result. For the TS2M3V, the confirmed specifications include a 1/2.7-inch sensor format, 3.0 µm pixel size and a stated dynamic range of 85 dB. The sensor manufacturer and exact sensor model have not been specified, so further sensor-level characteristics should be verified before the module is used in a design with strict imaging requirements.
▐ Product Advantages
01
Mechanical Fit Can Be Addressed Early
An 80 mm × 16 mm board leaves specific constraints for mounting holes, lens clearance, cable exits and enclosure depth. Defining the mechanical envelope before a custom PCB is released helps avoid changes late in the integration process.
02
Optics Are Matched to the Actual Scene
A 76° field of view is a useful starting point, but the required coverage depends on sensor format, lens characteristics, working distance and the area being captured. The final optical setup should be checked in the intended housing, not selected by FOV alone.
03
Interface and Power Requirements Stay in Scope
For a USB design, the host platform, cable length, current budget and supported output formats all matter. The TS2M3V is specified for USB 2.0 and USB bus power, with a stated working current of 400 mA. Compatibility should still be tested on the intended host and operating system.
04
Validation Before Production Release
Samples give engineering teams a chance to check image quality, focus, exposure, temperature behavior and mechanical installation before committing to a production run. The acceptance criteria should be agreed in advance so that prototype results can be compared with the final design.
▐ Why Choose Our Camera Module Customization Services
Requirements Review Before Hardware Changes
Resolution, target platform, lens angle, board outline, connector location and operating conditions are reviewed together. This helps establish which requirements can be met by an existing module and which call for a new or revised design.
EVT, DVT and PVT Development Stages
Engineering validation checks whether the prototype meets the initial requirements. Design validation examines the more complete design against agreed test criteria, while production validation checks the manufacturing process and representative production units before volume release. The specific tests depend on the product.
Manufacturing Planned Around Order Volume
Prototype quantities, pilot builds and repeat production orders place different demands on material planning, assembly and inspection. Production arrangements and lead times are confirmed against the selected design, component availability, order quantity and required quality checks.
▐ Application
▐ Certifications & Quality Assurance
ISO 9001
ISO 45001
ISO 14001
EMC Test
CE Certified
▐ Customization Service
A custom camera module starts with a clear definition of the product it must fit. Useful inputs include the target resolution, sensor preference, field of view, working distance, available PCB space, connector type, cable routing, power supply, host interface and operating environment. If a housing or carrier board already exists, mechanical drawings and interface documentation help identify constraints before design work begins.
Lens & Optics
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Sensor
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Mechanical Design
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Connector & I/O
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▐ FAQ
Q1: What information is needed to start a custom camera module project?
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Start with the application, target resolution, interface, preferred sensor if known, lens or field of view, working distance, PCB dimensions, connector and cable requirements, power budget, operating environment and estimated quantity. A mechanical drawing or target-system specification is useful when the module must fit an existing product.
Q2: Can an existing camera module be modified instead of developed from scratch?
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That depends on the gap between the existing module and the project requirements. Lens changes, cable or connector adjustments and some PCB adaptations may be more straightforward than a new sensor design. The available options should be reviewed against image performance, board layout, firmware and component availability before selecting the development route.
Q3: What is the difference between EVT, DVT and PVT?
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EVT, or Engineering Validation Test, checks whether the initial hardware meets the core requirements. DVT, or Design Validation Test, evaluates the more complete design against agreed functional, mechanical and environmental criteria. PVT, or Production Validation Test, checks the production process and representative units before mass production. Test items and acceptance limits should be defined for each project.
Q4: How long does custom camera module development take?
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Lead time depends on the amount of redesign, optical requirements, component availability, tooling needs and validation scope. An existing module with a limited modification may follow a different schedule from a new PCB or a design requiring firmware work. A project-specific schedule should be confirmed after the requirements and sample quantity have been reviewed.
Q5: Can the same custom camera module move from samples to mass production?
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Yes, subject to validation and production readiness. Before release, the project should establish the approved hardware revision, image acceptance criteria, critical dimensions, test procedure and packaging requirements. Pilot production can then be used to check assembly consistency and inspection results before larger orders are scheduled.
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